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20th European Microelectronics and Packaging Conference (EMPC)

14. - 16. September 2015

Das IMS ist mit zwei Vortr├Ągen auf der EMPC in Friedrichshafen vertreten.

Session 8.1: Challenges in 2.5D and 3D Packages
Mittwoch, 16.09.2015, 8:45 - 10:45
Low-Temperature Refill Process for Through-Silicon-Vias (TSVs) in Stacked Ultra-Thin Chip-on-Wafer by Aerosol Jet Printed Silver
Saleh Ferwana1, J├╝rgen Keck2, Mahadi-Ul Hassan1, Christine Harendt1, Joachim N. Burghartz1
1Institute f├╝r Mikroelektronik Stuttgart, Germany; 2Hahn-Schickard, Stuttgart, Germany

Session 3.1: PCB Technology
Montag, 14.09.2015, 16:50 - 18:30
Combining Organic and Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin for Robotic Applications
Mahadi-Ul Hassan1, Yigit Mahsereci 1, J├╝rgen Keck4, Hagen Klauk5, Jan Kostelnik3, Stefan Saller2, Alina Schreivogel3, Tarek Zaki1, Joachim N. Burghartz1
1Institute f├╝r Mikroelektronik Stuttgart, Germany; 2Festo AG & Co. KG, Esslingen, Germany; 3W├╝rth Elektronik GmbH & Co. KG, Rot am See, Germany; 4Hahn-Schickard, Stuttgart, Germany; 5Max-Planck-Institut f├╝r Festk├Ârperforschung, Stuttgart, Germany

Weitere Informationen finden Sie unter:
www.empc2015.org/

Ort: Graf-Zeppelin-Haus, Olgastra├če 20, 88045 Friedrichshafen, Germany