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IMS Publikationen

IMS Newsletter 1 / 2018

IMS Infomappe

Ute Zschieschang, James W. Borchert, Michael Geiger, Florian Letzkus, Joachim N. Burghartz, Hagen Klauk,
Stencil lithography for organic thin-film transistors with a channel length of 300 nm [Papers of journals (review)]
Organics Electronics, vol. 61, no. 10, pp. 65-69, October, 2018 (2018)
PDF orig., LINK

Lars Heuken, Muhammad Alshahed, Alessandro Ottaviani, Mohammed Alomari, Michael Heuken, Clemens Wächter, Thomas Bergunde, Ildikó Cora, Lajos Tóth, Béla Pécz, Joachim N. Burghartz
Temperature Dependent Vertical Conduction of GaN HEMT Structures on Silicon and Bulk GaN Substrates [Papers of journals (review)]
Physica Status Solidi A, Advanced Science News, p. 1800482, September 6, 2018, DOI: https://doi.org/10.1002/pssa.201800482 (2018)
LINK

Lars Heuken, Muhammad Alshahed, Alessandro Ottaviani, Mohammed Alomari, Ulrike Waizmann, Thomas Reindl Joachim N. Burghartz
Localization and analysis of surface charges trapped in AlGaN/GaN HEMTs using multiple secondary MIS gates [Conference papers]
in Proc. of 48 European Solid-State Device Research Conference (ESSDERC), Dresden, Deutland, (Vortrag), September 3, 2018 (2018)

Amro Eldebiky, Mourad Elsobky, Harald Richter, Joachim N. Burghartz,
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications [Papers of journals (review)]
Advances in Radio Science, vol. 106, no. 8, pp. 109-116, September, 2018, DOI: 10.5194 (2018)

Christine Harendt, Björn Albrecht
Hybride Systeme in Folie ‚Äď Chipintegration mit der Chip-Film Patch (CFP) Technologie [Sonstige]
Kurz-Tutorial auf der SMT Hybrid Packaging 2018, N√ľrnberg, 6. Juni 2018
PDF kurz

Sefa √Ėzbek, Golzar Alavi, Johannes Digel, Markus Gr√∂zing, Joachim N.Burghartz
3-Path SiGe BiCMOS Power Amplifier for IoT Applications on Thin Substrate [Papers of journals (review)]
Integration, VLSI, May 18, 2018, ISSN: 0167-9260 (2018)

Christine Harendt
Ultra-Thin Chips and Chip-Film Patch for Hybrid Systems in Foil ‚Äď Technology and Applications [Lectures]
Micro Assembly Day 2018, Berlin, Deutschland, May 17, 2018, (Vortrag) (2018)
PDF orig.

Muhammad Alshahed, Lars Heuken, Mohammed Alomari, Ildikó Cora, Lajos Tóth, Bèla Pècz, Clemens Wächter, Thomas Bergunde, Joachim N. Burghartz
Low-Dispersion, High-Voltage, Low-Leakage GaN HEMTs on Native GaN Substrates [Papers of journals (review)]
IEEE Transactions on Electron Devices, vol. 65, no. 7, pp. 2939-2947, May 16, 2018 (2018)

Joachim Deh, Thomas Deuble
IMS Newsletter 1/18 deutsch [Newsletter]
Institut f√ľr Mikroelektronik Stuttgart, 6. April 2018, 4 Seiten, no. 22 (2018)
PDF orig.

Joachim Deh, Thomas Deuble
IMS Newsletter 1/18 english [Newsletter]
Institut f√ľr Mikroelektronik Stuttgart, April 6, 2018, p. 4, no. 22 (2018)
PDF orig.