Publikationen
 

IMS Publikationen

IMS Newsletter 1 / 2019

IMS Infomappe

Lars Heuken, Muhammad Alshahed, Alessandro Ottaviani, Mohammed Alomari, Dirk Fahle, Michael Heuken, Jachim N. Burghartz
Temperature dependent lateral and vertical conduction mechanisms in AlGaN/GaN HEMT on thinned silicon substrate [Papers of journals]
Japanese Journal of Applied Physics, IOP Science, vol. 58, no. SC, pp. SCCD11-1-SCCD11-7, May 14, 2019 (2019)
LINK

Joachim Deh, Thomas Deuble
IMS Newsletter 1/19 deutsch [Newsletter]
Institut für Mikroelektronik Stuttgart, 22. März 2019, 4 Seiten, no. 23 (2019)
PDF orig.

Joachim Deh, Thomas Deuble
IMS Newsletter 1/19 english [Newsletter]
Institut für Mikroelektronik Stuttgart, March 22, 2019, p. 4, no. 23 (2019)
PDF orig.

Mourad Elsobky, Zili Yu, Thomas Deuble, Joachim N. Burghartz,
MultiSense: Ultra-Thin Reconfigurable Voltage and Capacitance Readout ASIC [Article in magazines]
EUROPRACTICE: 2018-2019 Activity Report, EUROPRACTICE, p. 23, March, 2019 (2019)
PDF orig., LINK

Yiğit Uygar Mahsereci
An Ultra-thin CMOS Sensor for In-plane Stress Sensing [PhD dissertation]
Elektrotechnik, Universität Stuttgart, Stuttgart, Deutschland, Prof. Dr.-Ing Joachim Burghartz, February 29, 2019, Shaker, p. 164, ISBN: 978-3844065138, ISSN: 1436-3801 (2019)
, PDF kurz, LINK

Franz Xaver Hutter
Hitzetauglich - Hochdynamische bildgebende Temperaturmesstechnik [Beitrag in Magazin]
Elektronik-Informationen, AT-Fachverlag GmbH, Wilhelm-Pfitzer-Str. 28, 70736 Fellbach, no. 2 / 2019, Seite 49-51, 1. Februar 2019 (2019)
PDF orig.

Franz X. Hutter
Hochdynamische bildgebende Temperaturmesstechnik [Beitrag in Magazin]
photonik, AT-Fachverlag GmbH, Wilhelm-Pfitzer-Str. 28, 70736 Fellbach, no. 6.2018, Seite 56-58, 5. Dezember 2018 (2018)
PDF orig.

Mourad Elsobky, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Christine Harendt, Harald Richter, Zili Yu, Joachim N. Burghartz
Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components [Conference papers (reviewed)]
in Proc. of Eurosensors 2018, Graz, Austria, (Vortrag), December 3, 2018, vol. 2, no. 748 (2018)
LINK

Golzar Alavi, Sefa Özbek, Mahsa Rasteh, Markus Grözing, Manfred Berroth, Jan Hesselbarth, Joachim N. Burghartz
Embedding and Interconnecting of Ultra-Thin RF Chip in Combination with Flexible Wireless Hub in Polymer Foil [Conference papers]
in 7th Electronics System-Integration Technology Conference 2018, Dresden, Germany, (Vortrag), November 29, 2018, p. 5, ISBN: 978-1-5386-6814-6 (2018)

Bjoern Albrecht, Golzar Alavi, Mourad Elsobky, Saleh Ferwana, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz
Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems [Conference papers]
in 7 Electronics System-Integration Technology Conference 2018, Dresden, Germany, (Vortrag), November 29, 2018, p. 5, ISBN: 978-1-5386-6814-6 (2018)