{"id":8513,"date":"2021-07-15T10:20:48","date_gmt":"2021-07-15T08:20:48","guid":{"rendered":"https:\/\/www.ims-chips.de\/?p=8513"},"modified":"2025-01-14T14:54:30","modified_gmt":"2025-01-14T13:54:30","slug":"id2ppac","status":"publish","type":"post","link":"https:\/\/www.ims-chips.de\/?p=8513","title":{"rendered":"ID2PPAC"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"8513\" class=\"elementor elementor-8513\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f8be919 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"f8be919\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-c0ea536 exad-glass-effect-no exad-sticky-section-no\" data-id=\"c0ea536\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-672976b exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"672976b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">Projekte <\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-49971e9 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"49971e9\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-066e9d7 exad-glass-effect-no exad-sticky-section-no\" data-id=\"066e9d7\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-31d8acf exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"31d8acf\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">ID2PPAC \u2013 Integration von Prozessen und Modulen f\u00fcr den 2-nm-Knoten<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-2eaae73 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"2eaae73\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-355c81e exad-glass-effect-no exad-sticky-section-no\" data-id=\"355c81e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-f65320c exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"f65320c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"344\" height=\"211\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21.jpg\" class=\"attachment-large size-large wp-image-8498\" alt=\"News Projekt ID2PPAC 2021\" srcset=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21.jpg 344w, https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21-300x184.jpg 300w\" sizes=\"(max-width: 344px) 100vw, 344px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d4018b0 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"d4018b0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Projektlaufzeit: 01.06.2021 &#8211; 31.05.2024<br \/>Gef\u00f6rdert durch das EU-Programm ECSEL Innovation Action<br \/>F\u00f6rderkennzeichen: 101007254<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-a6b7c77 exad-glass-effect-no exad-sticky-section-no\" data-id=\"a6b7c77\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-06f2015 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"06f2015\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>In dem von der Europ\u00e4ischen Union und dem Bundesministerium f\u00fcr Bildung und Forschung (BMBF) mit knapp 48 Mio.\u20ac gef\u00f6rderten ECSEL-Verbundprojekt ID2PPAC werden die im Vorg\u00e4ngerprojekt IT2 identifizierten Technologiel\u00f6sungen f\u00fcr den 2-nm-Knoten konsolidiert und integriert. Ziel ist es, zu zeigen, dass die Anforderungen an Leistung, Fl\u00e4che und Kosten (engl. Performance Power Area and Cost = PPAC) f\u00fcr diese neue Generation f\u00fchrender Logiktechnologie erreicht werden k\u00f6nnen.<\/p><p>Um das sog. Moore&#8217;sche Gesetz f\u00fcr den 2-nm-Knoten fortzusetzen und gleichzeitig die PPAC-Anforderungen zu erf\u00fcllen, ist die Kombination von weiteren Fortschritten in der EUV-Lithografie &amp; Masken, 3D-Bauteilstrukturen, Materialien und Metrologie erforderlich. Die St\u00e4rke des Projekts beruht auf einer gemeinsamen Pilotlinie und dem fokussierten Engagement der beteiligten Partner, die in wichtigen ineinandergreifenden Bereichen \u00fcber au\u00dferordentliche Expertise verf\u00fcgen.<br \/>Das ID2PPAC-Projekt soll IC-Fabs in die Lage versetzen, bis zum Jahr 2025 sog. EUV-basiertes Single-Print-High-Volume-Manufacturing f\u00fcr den 2nm-Knoten durchzuf\u00fchren. <br \/>Diese evolution\u00e4re Technologie wird durch die wachsende Nachfrage nach Rechenleistung angetrieben, die k\u00fcnftig mehr als exponentiell ansteigen wird und aus einer Welt mit 1 Mrd. miteinander verbundener Ger\u00e4te w\u00e4hrend der &#8222;PC-\u00c4ra&#8220; \u00fcber eine Welt mit 10 Mrd. verbundener Ger\u00e4te in der &#8222;Mobile + Cloud-\u00c4ra&#8220; hin zur zuk\u00fcnftigen &#8222;Intelligenz-\u00c4ra\u201c f\u00fchrt, in der es \u00fcber 100 Mrd. intelligente, verbundene Ger\u00e4te geben wird. Um dieses Wachstum zu erm\u00f6glichen, arbeitet die Halbleiterindustrie kontinuierlich an technologischen Innovationen, die diesen Fortschritt, wie er durch Moore&#8217;s Law vorhergesagt wurde und weiterhin wird, realisieren sollen.<br \/>Das Projekt wird auch dazu beitragen, die technologische Handlungsf\u00e4higkeit Europas in diesem Bereich, der f\u00fcr die Digitalisierung, (Edge-)AI und f\u00fcr die L\u00f6sung nationaler, europ\u00e4ischer und globaler gesellschaftlicher Herausforderungen entscheidend ist, auszubauen und das Konsortium aus f\u00fchrenden europ\u00e4ischen Unternehmen und Instituten, die in diesem Bereich t\u00e4tig sind, zu st\u00e4rken.<br \/>Das Institut f\u00fcr Mikroelektronik Stuttgart (IMS CHIPS) wird im Arbeitspaket Lithografie-Ausr\u00fcstung mitarbeiten. Teil dieses Arbeitspaketes ist die Entwicklung von hochpr\u00e4zisen diffraktiven optischen Elementen (DOE) f\u00fcr die Oberfl\u00e4chenpr\u00fcfung von EUV-Spiegeln.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-b1baa35 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"b1baa35\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-f8b7cf4 exad-glass-effect-no exad-sticky-section-no\" data-id=\"f8b7cf4\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a1fa359 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"a1fa359\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Informationen zum Projekt finden Sie unter:<\/p><p><a href=\"https:\/\/cordis.europa.eu\/project\/id\/101007254\/de\" target=\"_blank\" rel=\"noopener\">https:\/\/cordis.europa.eu\/project\/id\/101007254\/de<\/a><\/p><p><a href=\"https:\/\/www.elektronikforschung.de\/projekte\/id2ppac\" target=\"_blank\" rel=\"noopener\">https:\/\/www.elektronikforschung.de\/projekte\/id2ppac<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e365f85 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"e365f85\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<strong>Kontakt:<\/strong>\n\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-inner-section elementor-element elementor-element-23ff211 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"23ff211\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-inner-column elementor-element elementor-element-150bcf0 exad-glass-effect-no exad-sticky-section-no\" data-id=\"150bcf0\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a6fd8d0 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"a6fd8d0\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Julian Hartbaum<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-inner-column elementor-element elementor-element-4cd6552 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4cd6552\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-b2715cb exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"b2715cb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Tel: +49 711 21855\u00a0 471<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-inner-column elementor-element elementor-element-b5caf70 exad-glass-effect-no exad-sticky-section-no\" data-id=\"b5caf70\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-c05301a exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"c05301a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"mailto:hartbaum@ims-chips.de\">E-Mail<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Integration von Prozessen und Modulen f\u00fcr 2-nmChip-Technologien.<\/p>\n","protected":false},"author":3,"featured_media":8498,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[39],"tags":[],"class_list":["post-8513","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-projekte-archiv"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>ID2PPAC - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"Im Projekt ID2PPAC werden die im 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