{"id":8497,"date":"2021-07-15T09:31:45","date_gmt":"2021-07-15T07:31:45","guid":{"rendered":"https:\/\/www.ims-chips.de\/?p=8497"},"modified":"2021-11-16T13:01:54","modified_gmt":"2021-11-16T12:01:54","slug":"id2ppac-integration-von-prozessen-und-modulen-fuer-den-2-nm-knoten","status":"publish","type":"post","link":"https:\/\/www.ims-chips.de\/?p=8497","title":{"rendered":"ID2PPAC \u2013 Integration von Prozessen und Modulen f\u00fcr den 2-nm-Knoten"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"8497\" class=\"elementor elementor-8497\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-8e921d8 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"8e921d8\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-8898761 exad-glass-effect-no exad-sticky-section-no\" data-id=\"8898761\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-13410c2 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"13410c2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">ID2PPAC \u2013 Integration von Prozessen und Modulen f\u00fcr den 2-nm-Knoten<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f0a2152 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"f0a2152\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-47cb302 exad-glass-effect-no exad-sticky-section-no\" data-id=\"47cb302\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-c678bc4 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"c678bc4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"344\" height=\"211\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21.jpg\" class=\"attachment-large size-large wp-image-8498\" alt=\"News Projekt ID2PPAC 2021\" srcset=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21.jpg 344w, https:\/\/www.ims-chips.de\/wp-content\/uploads\/2021\/07\/News_Projekt_ID2PPAC_21-300x184.jpg 300w\" sizes=\"(max-width: 344px) 100vw, 344px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-a38a922 exad-glass-effect-no exad-sticky-section-no\" data-id=\"a38a922\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-e12bca9 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"e12bca9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>In dem von der Europ\u00e4ischen Union und dem Bundesministerium f\u00fcr Bildung und Forschung (BMBF) mit knapp 48 Mio.\u20ac gef\u00f6rderten ECSEL-Verbundprojekt ID2PPAC werden die im Vorg\u00e4ngerprojekt IT2 identifizierten Technologiel\u00f6sungen f\u00fcr den 2-nm-Knoten konsolidiert und integriert. Ziel ist es, zu zeigen, dass die Anforderungen an Leistung, Fl\u00e4che und Kosten (engl. Performance Power Area and Cost = PPAC) f\u00fcr diese neue Generation f\u00fchrender Logiktechnologie erreicht werden k\u00f6nnen.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-5c20ed94 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"5c20ed94\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-4e204db9 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4e204db9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-1d866360 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"1d866360\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Um das sog. Moore&#8217;sche Gesetz f\u00fcr den 2-nm-Knoten fortzusetzen und gleichzeitig die PPAC-Anforderungen zu erf\u00fcllen, ist die Kombination von weiteren Fortschritten in der EUV-Lithografie &amp; Masken, 3D-Bauteilstrukturen, Materialien und Metrologie erforderlich. Die St\u00e4rke des Projekts beruht auf einer gemeinsamen Pilotlinie und dem fokussierten Engagement der beteiligten Partner, die in wichtigen ineinandergreifenden Bereichen \u00fcber au\u00dferordentliche Expertise verf\u00fcgen.<br \/>Das ID2PPAC-Projekt soll IC-Fabs in die Lage versetzen, bis zum Jahr 2025 sog. EUV-basiertes Single-Print-High-Volume-Manufacturing f\u00fcr den 2-nm-Knoten durchzuf\u00fchren. <br \/>Diese evolution\u00e4re Technologie wird durch die wachsende Nachfrage nach Rechenleistung angetrieben, die k\u00fcnftig mehr als exponentiell ansteigen wird und aus einer Welt mit 1 Mrd. miteinander verbundener Ger\u00e4te w\u00e4hrend der &#8222;PC-\u00c4ra&#8220; \u00fcber eine Welt mit 10 Mrd. verbundener Ger\u00e4te in der &#8222;Mobile + Cloud-\u00c4ra&#8220; hin zur zuk\u00fcnftigen &#8222;Intelligenz-\u00c4ra\u201c f\u00fchrt, in der es \u00fcber 100 Mrd. intelligente, verbundene Ger\u00e4te geben wird. Um dieses Wachstum zu erm\u00f6glichen, arbeitet die Halbleiterindustrie kontinuierlich an technologischen Innovationen, die diesen Fortschritt, wie er durch Moore&#8217;s Law vorhergesagt wurde und weiterhin wird, realisieren sollen.<br \/>Das Projekt wird auch dazu beitragen, die technologische Handlungsf\u00e4higkeit Europas in diesem Bereich, der f\u00fcr die Digitalisierung, (Edge-)AI und f\u00fcr die L\u00f6sung nationaler, europ\u00e4ischer und globaler gesellschaftlicher Herausforderungen entscheidend ist, auszubauen und das Konsortium aus f\u00fchrenden europ\u00e4ischen Unternehmen und Instituten, die in diesem Bereich t\u00e4tig sind, zu st\u00e4rken.<br \/>Das Institut f\u00fcr Mikroelektronik Stuttgart (IMS CHIPS) wird im Arbeitspaket Lithografie-Ausr\u00fcstung mitarbeiten. Teil dieses Arbeitspaketes ist die Entwicklung von hochpr\u00e4zisen diffraktiven optischen Elementen (DOE) f\u00fcr die Oberfl\u00e4chenpr\u00fcfung von EUV-Spiegeln.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-49b274a elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"49b274a\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-4fcfc74 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4fcfc74\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-70de8ce exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"70de8ce\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Informationen zum Projekt finden Sie unter:<\/p><p><a href=\"https:\/\/cordis.europa.eu\/project\/id\/101007254\/de\" target=\"_blank\" rel=\"noopener\">https:\/\/cordis.europa.eu\/<\/a><\/p><p><a href=\"https:\/\/www.elektronikforschung.de\/projekte\/id2ppac\" target=\"_blank\" rel=\"noopener\">https:\/\/www.elektronikforschung.de\/<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-213b5b2 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"213b5b2\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-702fafb exad-glass-effect-no exad-sticky-section-no\" data-id=\"702fafb\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-eaed0d7 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-spacer\" data-id=\"eaed0d7\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Im Projekt ID2PPAC werden die im Vorg\u00e4ngerprojekt IT2 identifizierten Technologiel\u00f6sungen f\u00fcr den 2-nm-Knoten konsolidiert und integriert.<\/p>\n","protected":false},"author":3,"featured_media":8498,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[],"class_list":["post-8497","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-archiv"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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