{"id":461,"date":"2020-05-17T15:11:00","date_gmt":"2020-05-17T13:11:00","guid":{"rendered":"https:\/\/start.ims-chips.de\/?p=461"},"modified":"2020-10-12T11:55:53","modified_gmt":"2020-10-12T09:55:53","slug":"ieee-2020","status":"publish","type":"post","link":"https:\/\/www.ims-chips.de\/?p=461","title":{"rendered":"IEEE 2020"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"461\" class=\"elementor elementor-461\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-9bc03a2 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"9bc03a2\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-9772453 exad-glass-effect-no exad-sticky-section-no\" data-id=\"9772453\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-711474f exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-heading\" data-id=\"711474f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">IEEE 2020<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-41c9148 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"41c9148\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-4e5ac51 exad-glass-effect-no exad-sticky-section-no\" data-id=\"4e5ac51\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-91c2fd4 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-image\" data-id=\"91c2fd4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"344\" height=\"211\" src=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg\" class=\"attachment-large size-large wp-image-1592\" alt=\"IEEE FLEPS 2020\" srcset=\"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg 344w, https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20-300x184.jpg 300w\" sizes=\"(max-width: 344px) 100vw, 344px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-7a7c06e exad-glass-effect-no exad-sticky-section-no\" data-id=\"7a7c06e\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-0ab1f8e exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"0ab1f8e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK<\/strong><\/p><p>Das IMS ist mit einem Vortrag bei der <b>IEEE International Conference on Flexible and Printable Sensors and System<\/b>s in Manchester vertreten.<\/p><p>Hybrid Systems on Foil, Heterogenous Integration &amp; Packaging Session <br \/>Sonntag 16. August 2020, 09:00 &#8211; 17:00 Uhr<\/p><p><b>\u201eChip-Film Patch Sensor System with Integrated Read-Out ASIC for Biomedical Applications\u201c<\/b> <br \/>Ulrike Passlack, Mourad Elsobky, Andreas Mueller, Cor Scherjon, Christine Harendt, Joachim Burghartz<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-41ea2d95 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"41ea2d95\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-1f1bcc82 exad-glass-effect-no exad-sticky-section-no\" data-id=\"1f1bcc82\" data-element_type=\"column\" data-e-type=\"column\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-599859b5 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-text-editor\" data-id=\"599859b5\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Weitere Informationen zur IEEE FLEPS 2020 finden Sie auf folgender Website: <a href=\"https:\/\/2020.ieee-fleps.org\/\">https:\/\/2020.ieee-fleps.org\/<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-c329762 elementor-section-boxed elementor-section-height-default elementor-section-height-default exad-glass-effect-no exad-sticky-section-no\" data-id=\"c329762\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-37eefd9 exad-glass-effect-no exad-sticky-section-no\" data-id=\"37eefd9\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-754eb30 exad-sticky-section-no exad-glass-effect-no elementor-widget elementor-widget-spacer\" data-id=\"754eb30\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"spacer.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-spacer\">\n\t\t\t<div class=\"elementor-spacer-inner\"><\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>IEEE 2020 IEEE International Conference on Flexible and Printable Sensors and Systems 2020, Manchester, UK Das IMS ist mit einem Vortrag bei der IEEE International Conference on Flexible and Printable Sensors and Systems in Manchester vertreten. Hybrid Systems on Foil, Heterogenous Integration &amp; Packaging Session Sonntag 16. August 2020, 09:00 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":1592,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[],"class_list":["post-461","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-archiv"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"Mikroelektronik und Nanotechnologien: Integrierte Schaltungen &amp; Systeme, Bildgebende Sensorik, Halbleiterintegration, M(E)MS-Technologien, Nanostrukturierung\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.de\/?p=461\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"IEEE 2020 - 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Institut f\u00fcr Mikroelektronik Stuttgart\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/?p=461#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/?p=461#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ims-chips.de\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"datePublished\":\"2020-05-17T13:11:00+00:00\",\"dateModified\":\"2020-10-12T09:55:53+00:00\",\"description\":\"Mikroelektronik und Nanotechnologien: Integrierte Schaltungen & Systeme, Bildgebende Sensorik, Halbleiterintegration, M(E)MS-Technologien, Nanostrukturierung\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/?p=461#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.ims-chips.de\\\/?p=461\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/?p=461#primaryimage\",\"url\":\"https:\\\/\\\/www.ims-chips.de\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.de\\\/wp-content\\\/uploads\\\/2020\\\/05\\\/News_Bild_IEEE_FLEPS_20.jpg\",\"width\":344,\"height\":211,\"caption\":\"IEEE FLEPS 2020\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/?p=461#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\\\/\\\/www.ims-chips.de\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"IEEE 2020\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#website\",\"url\":\"https:\\\/\\\/www.ims-chips.de\\\/\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"description\":\"\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.ims-chips.de\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#organization\",\"name\":\"Institut f\u00fcr Mikroelektronik Stuttgart\",\"alternateName\":\"IMS CHIPS\",\"url\":\"https:\\\/\\\/www.ims-chips.de\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.ims-chips.de\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"contentUrl\":\"https:\\\/\\\/www.ims-chips.de\\\/wp-content\\\/uploads\\\/2020\\\/09\\\/logo_ims.png\",\"width\":262,\"height\":65,\"caption\":\"Institut f\u00fcr Mikroelektronik Stuttgart\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.ims-chips.de\\\/#\\\/schema\\\/person\\\/9839fb63530e7563aa83867413b8c6e7\",\"name\":\"meier\",\"sameAs\":[\"https:\\\/\\\/www.ims-chips.de\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","description":"Mikroelektronik und Nanotechnologien: Integrierte Schaltungen & Systeme, Bildgebende Sensorik, Halbleiterintegration, M(E)MS-Technologien, Nanostrukturierung","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ims-chips.de\/?p=461","og_locale":"de_DE","og_type":"article","og_title":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","og_description":"Mikroelektronik und Nanotechnologien: Integrierte Schaltungen & Systeme, Bildgebende Sensorik, Halbleiterintegration, M(E)MS-Technologien, Nanostrukturierung","og_url":"https:\/\/www.ims-chips.de\/?p=461","og_site_name":"Institut f\u00fcr Mikroelektronik Stuttgart","article_published_time":"2020-05-17T13:11:00+00:00","article_modified_time":"2020-10-12T09:55:53+00:00","og_image":[{"width":344,"height":211,"url":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","type":"image\/jpeg"}],"author":"meier","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"meier"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ims-chips.de\/?p=461#article","isPartOf":{"@id":"https:\/\/www.ims-chips.de\/?p=461"},"author":{"name":"meier","@id":"https:\/\/www.ims-chips.de\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7"},"headline":"IEEE 2020","datePublished":"2020-05-17T13:11:00+00:00","dateModified":"2020-10-12T09:55:53+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ims-chips.de\/?p=461"},"wordCount":84,"publisher":{"@id":"https:\/\/www.ims-chips.de\/#organization"},"image":{"@id":"https:\/\/www.ims-chips.de\/?p=461#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","articleSection":["Archiv"],"inLanguage":"de"},{"@type":"WebPage","@id":"https:\/\/www.ims-chips.de\/?p=461","url":"https:\/\/www.ims-chips.de\/?p=461","name":"IEEE 2020 - Institut f\u00fcr Mikroelektronik Stuttgart","isPartOf":{"@id":"https:\/\/www.ims-chips.de\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.ims-chips.de\/?p=461#primaryimage"},"image":{"@id":"https:\/\/www.ims-chips.de\/?p=461#primaryimage"},"thumbnailUrl":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","datePublished":"2020-05-17T13:11:00+00:00","dateModified":"2020-10-12T09:55:53+00:00","description":"Mikroelektronik und Nanotechnologien: Integrierte Schaltungen & Systeme, Bildgebende Sensorik, Halbleiterintegration, M(E)MS-Technologien, Nanostrukturierung","breadcrumb":{"@id":"https:\/\/www.ims-chips.de\/?p=461#breadcrumb"},"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ims-chips.de\/?p=461"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.ims-chips.de\/?p=461#primaryimage","url":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","contentUrl":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/05\/News_Bild_IEEE_FLEPS_20.jpg","width":344,"height":211,"caption":"IEEE FLEPS 2020"},{"@type":"BreadcrumbList","@id":"https:\/\/www.ims-chips.de\/?p=461#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.ims-chips.de\/"},{"@type":"ListItem","position":2,"name":"IEEE 2020"}]},{"@type":"WebSite","@id":"https:\/\/www.ims-chips.de\/#website","url":"https:\/\/www.ims-chips.de\/","name":"Institut f\u00fcr Mikroelektronik Stuttgart","description":"","publisher":{"@id":"https:\/\/www.ims-chips.de\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ims-chips.de\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Organization","@id":"https:\/\/www.ims-chips.de\/#organization","name":"Institut f\u00fcr Mikroelektronik Stuttgart","alternateName":"IMS CHIPS","url":"https:\/\/www.ims-chips.de\/","logo":{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.ims-chips.de\/#\/schema\/logo\/image\/","url":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/09\/logo_ims.png","contentUrl":"https:\/\/www.ims-chips.de\/wp-content\/uploads\/2020\/09\/logo_ims.png","width":262,"height":65,"caption":"Institut f\u00fcr Mikroelektronik Stuttgart"},"image":{"@id":"https:\/\/www.ims-chips.de\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.ims-chips.de\/#\/schema\/person\/9839fb63530e7563aa83867413b8c6e7","name":"meier","sameAs":["https:\/\/www.ims-chips.de"]}]}},"_links":{"self":[{"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/posts\/461","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=461"}],"version-history":[{"count":0,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/posts\/461\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=\/wp\/v2\/media\/1592"}],"wp:attachment":[{"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=461"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=461"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ims-chips.de\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=461"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}