{"id":12313,"date":"2024-12-06T09:12:51","date_gmt":"2024-12-06T08:12:51","guid":{"rendered":"https:\/\/www.ims-chips.de\/?p=12313"},"modified":"2025-04-01T10:11:12","modified_gmt":"2025-04-01T08:11:12","slug":"projekt-enspect","status":"publish","type":"post","link":"https:\/\/www.ims-chips.de\/?p=12313","title":{"rendered":"Projekt ENSPECT"},"content":{"rendered":"\t\t
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Projekt ENSPECT<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Kick-off Meeting am 20.11.2024 f\u00fcr ENSPECT beim Deutschen Zentrum f\u00fcr Luft- und Raumfahrt in Bonn<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"Kick-off\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Projektzeitraum: 01.11.2024 \u2013 31.10.2027
Gef\u00f6rdert vom BMWK
F\u00f6rderkennzeichen: 50PS2401<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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„Enabling New Space Power Electronics“ ist das Motto des neuen Verbundvorhabens ENSPECT, das vom Bundesministerium f\u00fcr Wirtschaft und Klimaschutz (BMWK) gef\u00f6rdert und vom Deutschen Zentrum f\u00fcr Luft- und Raumfahrt (DLR) als Projekttr\u00e4ger betreut wird. In dem Projekt sollen die Auswirkungen von Strahlung, wie sie im Weltraum vorkommt, auf leistungselektronische Baugruppen auf GaN-Basis untersucht werden. \u00a0Projektpartner sind die Universit\u00e4t Stuttgart mit ihrem Institut f\u00fcr Robuste Leistungshalbleitersysteme, das Fraunhofer-Institut f\u00fcr Angewandte Festk\u00f6rperphysik aus Freiburg, das Institut f\u00fcr Mikroelektronik Stuttgart und die TESAT-Spacecom GmbH und Co. KG aus Backnang.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Mit neuartigen elektronischen Bauteilen, die aus dem Halbleiter-Werkstoff Gallium-Nitrid hergestellt werden, lassen sich sehr schnelle und verlustarme Wandler f\u00fcr elektrische Energie bauen. So gibt es bereits sehr kompakte und energieeffiziente Handy-Ladeger\u00e4te, die von GaN-Bauteilen profitieren. Auch in der Regelung elektrischer Energie in Elektrofahrzeugen oder Photovoltaik-Anlagen, k\u00f6nnen diese neuen Bauteile eingesetzt werden. Um die Vorteile der GaN-Technologie auf in kritischen Weltraum-Anwendungen wie Satelliten nutzen zu k\u00f6nnen, muss die „Weltraumtauglichkeit“ untersucht und nachgewiesen werden. Mit der TESAT Spacecom GmbH aus dem schw\u00e4bischen Backnang ist einer der international f\u00fchrenden Anbieter von Satelliten-Elektronik und -Kommunikationstechnik Partner des Projekts ENSPECT und wird ausgew\u00e4hlte GaN-Komponenten simulierten Weltraumbedingungen aussetzen, insbesondere geht es dabei um die Robustheit gegen ionisierende Strahlung, der Satelliten im Weltraum stark ausgesetzt sind. Diese Strahlung kann elektronische Bauteile altern oder ausfallen lassen. Die Projektpartner Untersuchen deshalb den Einfluss solcher Strahlenbelastung auf GaN-Bauteile, um ein Verst\u00e4ndnis f\u00fcr die Vorg\u00e4nge zu bekommen und geeignete Bauteil-Strukturen und Betriebsarten f\u00fcr den Einsatz in Weltraumsatelliten definieren zu k\u00f6nnen.<\/p>

Das Projekt wird vom BMWK mit rund 1,07 Mio. \u20ac gef\u00f6rdert und hat eine Laufzeit von 3 Jahren (F\u00f6rderkennzeichen 50PS2401)<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Weiter Informationen zum Projekt ENSPECT Sie hier: www.ilh.uni-stuttgart.de\/<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Kick-off Meeting am f\u00fcr ENSPECT beim Deutschen Zentrum f\u00fcr Luft- und Raumfahrt in Bonn<\/p>\n","protected":false},"author":1,"featured_media":12314,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[7],"tags":[45],"class_list":["post-12313","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-archiv","tag-enspect"],"yoast_head":"\nProjekt ENSPECT - Institut f\u00fcr Mikroelektronik Stuttgart<\/title>\n<meta name=\"description\" content=\"Kick-off Meeting am f\u00fcr ENSPECT beim Deutschen Zentrum f\u00fcr Luft- und Raumfahrt in Bonn\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ims-chips.de\/?p=12313\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Projekt ENSPECT - 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