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Flexible Packaging - FlexPacFAM

Flexible Packaging of micro system technology components based on conductor board carriers using film-assisted molding

Encapsulated microelectronic components are only available at reasonable conditions (costs, delivery times) when acquired in large quantities. To small and medium-sized companies in particular this poses a barrier for the prototype manufacture and series start-up.

Size: 7 x 7 x 0.9 mm / 48 Pins conductor board: 300 Āµm, 4-tier

This is where FlexPacFAM offers an excellent alternative:

In the completed AiF-sponsored FlexPacFAM project (FV-Nr. 17602 N) saw the exemplary development, production and successful reliability study of closed conductor board-based QFN packaging (QFN-FlexPac / Inertialsensor-FlexPac) and QFN packaging with an opening (Image sensor-FlexPac) using the film-assisted molding process (FAM).

This proved the technologyĀ“s potential for readily available packaging solutions. Based on the project results, commonly used standard packages can be produced on a conductor board basis. Also, a transfer from expensive metal and ceramics packages to conductor board-based is easily realized.

In contrast to the common transfer molding the FAM technique has both halves of the tool covered with thin foil in order to avoid direct contact between the Duroplast and the form. The advantages of this process make a simplified and more cost-efficient mould possible.

Size: 10.6 x 10.6 x 2.8 mm / 23 Pins conductor board: 730 Āµm, 4-tier

Size: 14.2 x 14.2 x 2.2 mm / 48 Pins conductor board: 550 Āµm, 4-tier

Both research facilities (Hahn-Schickard and IMS CHIPS) offer their individual competences in chip packaging using the FAM technology through the PRONTO platform.

Information in the overall process procedure is available at FlexPacFAM Prozess-Flow.pdf.

Contact
For further information, please contact: Armin Berndt