Micro electric mechanic systems
IMS CHIPS has developed technologies that post-process finished CMOS chips with add-on steps. These include: deep silicon etching, the selective thinning of components areas to membranes or layer thining and structuring. These steps can be carried out on foundry as well as IMS CHIPS CMOS wafers.
In addition, CMOS circuits and micro-mechanic components can be arranged facing each other and equipped with electrical interfaces.
For more information, please go to Fields of Activity - MEMS - Micro electro mechanic systems