IMS offers a complete ceramics packaging process certified according to QC 01002 3 (EN 100114). 150 mm and 200 mm wafers can be processed by grinding, etching and scaling them down (f. e., 8“ diameter reduced to 6“). All common ceramics packaging can be processed with the chips with a fully automatic Wedge Wedge Bonder using aluminium and a gold wire bonder also being available. Airtightly ceiled with metal covers und chips with glas coverings for optical components and image sensors are part of our basic product and pattern line. A high vaccum coating plant for the back metalization is available for special applications. We look back on extended experience in packaging of ultra-thin silicon chips on flexible substrates and chip-on boards.
See also Packaging at IMS