The Institut für Mikroelektronik Stuttgart developed a new process to manufacture microchips with a total thickness of less than 20 µm. The process is based on the generation of cavities in silicon wafers a few micrometers below the surface that enable a breaking off of the chips from the wafer surface after the integration of electronic circuits.
For more information, please go to
Fields of activity - Ultra-thin chips
Contrary to this is the common process of manufacturing thin chips is the thinning of the wafers after circuit integration. Using this technology chips with a thickness of 200 micrometers are commonly manufactured.